Home > Copper Plating Additives >

Stable High Leveling Acid Copper Plating Additives With High Impurity Tolerance

Product Categories

Wuhan Aobong Surface Technique Co., Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

Add to Cart

R·G-910 High Leveling Acid Copper Plating Additive

Performance & Features

Innovative ultra-high concentrated composite formula with leveling power up to 95%.
Easy bath control; coatings free of pinholes, low internal stress and ultra-high ductility.
Extremely stable plating solution, crystal clear bright surface without fogging.
High impurity tolerance and long bath service life.

Operating Parameters

Item	Concentration Range
Copper Sulfate Pentahydrate (CuSO₄·5H₂O)	160–210 g/L
Pure Sulfuric Acid (Specific gravity=1.84)	50–70 g/L
Chloride Ion	60–120 mg/L (ppm)
R·G-910 MU Make-up Agent	4–10 mL/L
R·G-910 A Primary Brightener	0.4–0.8 mL/L
R·G-910 B Primary Brightener	0.3–0.5 mL/L
Operating Temperature	20–30 ℃
Cathode Current Density	1–8 A/dm²
Anode Current Density	0.5–3.0 A/dm²
Anode Material	Phosphor copper balls (0.03–0.06% P)
Agitation	Air agitation or mechanical agitation

Product Tags:

High Leveling Copper Plating Additives

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Wuhan Aobong Surface Technique Co., Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

Explore more Copper Plating Additives products from this supplier

Find Similar Products By Category:

Computer Hardware & Software