Advanced electroplating additives engineered to deliver superior performance in copper plating applications.

H1 is an excellent filling and brightening agent in the acid copper process, and when combined with other intermediates such as SP, PN, P, GISS, dye intermediates, etc., it forms a high-performance acid copper additive; Usually, it is dissolved separately before preparing the brightener. Suitable for acid copper plating process and cyanide free alkaline zinc plating process on hardware. The consumption is 0.01-0.05g/KAH.

• Strong leveling agent for uniform copper deposition
• Brightening agent for enhanced surface finish quality

• Formula for Acid Copper Plating Process on Hardware

  Points to note:
  H1 can be used in combination with SP, PN, P, GISS, MT-480, MT-880, AESS, dye intermediates, etc. to prepare high-performance acid copper additives. The dosage in the plating solution is 0.0004-0.001g/L, and the brightness and filling degree will decrease when the content is low; If the content is too high, it will produce dendritic bright stripes, which can be treated with a small amount of SP or activated carbon adsorption electrolysis.

  Formula for cyanide free alkaline zinc process
  Points to note:
  The combination of H1 and intermediate materials such as BPC, IZE, WT, DPE-III can be used to prepare high-performance alkaline galvanizing additives. The dosage in the plating solution is 0.01-0.02g/L. When the content is low, the brightness decreases, and when the content is too high, the coating is prone to brittleness. Softening agents can be added to eliminate brittleness or low current electrolytic treatment can be used.